PCB design and simulation, end to end.
Six disciplines covering every stage of semiconductor test PCB design engineering, from concept to fabrication, validated by full SI/PI simulation.
Load Boards
The mechanical and electrical interface between the Device Under Test and Automatic Test Equipment. Engineered for repeatable, low noise production testing.
Explore Load BoardsProbe Card Layout
Vertical, cantilever and MEMS probe card layouts. Impedance control, delay matching, and RF aware routing for accurate wafer level test.
Explore Probe Card LayoutBurn in Boards
Burn in boards that stress ICs under controlled conditions to expose early life failures. Engineered for thermal endurance and consistent results.
Explore Burn in BoardsSignal Integrity (SI)
Full SI simulation and validation. Via impedance optimization, S-parameter extraction, TDR plots, eye diagrams, crosstalk, EMI/EMC compliance, and failure root cause analysis.
Explore Signal Integrity (SI)Power Integrity & Thermal
DC IR drop, Z11 impedance, decap optimization, SSN/SSO, and electrical thermal co simulation for power dense modern silicon.
Explore Power Integrity & ThermalMLO Package Design
Multi layer organic substrate and package layout with full simulation. Flagship reference: 4,714 die pins, 556 signals at 1500 MHz, ~1 month including review.
Explore MLO Package DesignHDI-RF & Commercial PCB Design
HDI + RF/microwave PCB layout with controlled-impedance stackups, microvias, back-drill, hybrid stripline/microstrip mixes, and EMI/EMC-aware routing for clean eyes and quiet emissions.
Explore HDI-RF & Commercial PCB Design