Capabilities
Designed, simulated, and validated to the limit.
Designing capabilities
- ›Thru hole & SMT
- ›Layers 2 – 64
- ›Blind & buried vias
- ›Back drilling
- ›Stitching vias
- ›Fine pitch sockets (0.5 & 0.4 mm)
- ›Matched length / delay ±1 mil
- ›Controlled impedance ±5%
- ›Multiple impedances on same layer
- ›Curved traces
- ›Board thickness 62 – 250 mils
- ›Boards up to 50 GHz
- ›High current up to 1000 A
- ›DRAM & memory cards
Design and simulation tools
AllegroAltiumOrCAD CISPCADAutoCADCAM350CAMtasticCST StudioHFSSSIwaveKeysight ADSPowerSIHyperLynx
Key highlights
- High speed design · DRAM & memory devices · intricate layouts
- Cutting edge EDA/CAD tools
- Exceptional signal integrity & noise reduction techniques
- Peak performance in challenging environments
Signal Integrity · Capabilities
Via impedance optimization
Using Full wave EM / 3D solver
S-Parameter extraction
Using 2.5D & 3D solvers
TDR impedance plot
Using the TDR result to optimize on channel performance
Time domain analysis
To generate various waveforms · Simulation using IBIS-AMI simulation models · Eye diagram generation · Skew calculation · Various interface compliance · DDR, PCIe, Ethernet, SERDES, USB, UFS, MIPI, SFP, HDMI etc.
RF channel analysis
Matching network analysis and loss analysis
Crosstalk analysis
In frequency & time domain
RLGC Extraction EMI
Using quasi static solvers
EMI / EMC test failure board analysis
Checking EMC / EMI compliance with FCC / CISPR standards · To find the possible reason for failure of a board using simulation
SI · Interfaces & Simulations
LPDDR4 / LPDDR4x
Eye diagrams & crosstalk
Serial links (end to end)
Eye / crosstalk up to 56 Gbps
Serial link loopbacks
TDR / RL / IL up to 112 Gbps PAM4
USB 3.0 / 3.1
Eye / crosstalk 5 / 10 Gbps
SATA
6 Gbps
HDMI
13 Gbps
GbE
10 / 112 Gbps
PCIe
4 – 32 Gbps
RF channel
RL / IL 12 – 80 GHz
Power Integrity · Capabilities
DC IR drop analysis
Voltage distribution & ground bounce
Power impedance Z11 analysis
PDN target impedance shaping
Decap optimization
Value, count, placement
Time domain analysis
IC current profiles (pwl / cpm)
SSN / SSO analysis
Simultaneous switching noise
Thermal simulation
Steady state and transient
Thermal electrical co simulation
Power & temperature coupled
Tools: SIwave · ANSYS HFSS · PDNs to 480 A simulated
Deliverables
Engineering packages, fully documented.
PCB layout CAD
Load boards, probe cards, burn in boards, HAST/THB-85/85, custom PCBs.
Library management
Sockets, components, ICs, symbols.
Mechanical drafting
Frame, heat sink, fixtures.
Fabrication pack
Schematics, assembly drawings, DXF, PDF, BOM.
Production data
Gerbers, drill, IPC netlist, ODB/ODB++.
Custom reports
X/Y component data, length & pin reports, custom outputs.