Predict & manage heat for ATE PCBs—CFD analysis, hotspot detection, heatsink/airflow validation, and design changes that keep junction temps in spec.
HPCB Thermal Analysis Services
Prevent hotspots before prototype. So you avoid last-minute heatsink changes and schedule slips.
What We Model in Thermal Simulation
- Copper thickness & stack-up (conductivity, heat spreading, via density)
- Material thermal properties (FR‑4 vs high‑Tg, ceramics, TIMs)
- Power maps by test phase (idle, ramp, peak patterns, dwell)
- Ambient & fixtures inside tester/prober chambers (walls, fixtures)
- Airflow from the ATE cooling system (speed, direction, inlets/outlets)
- Sockets, DUT & contact areas (localized heating, case/junction estimates when package data is available)
- Heatsinks/fans (if present) and placement of temp sensors for monitoring.
Why It Matters for ATE Boards
- High power / high density layouts concentrate heat; without planning, traces, planes, and sockets run hot and shorten lifetime.
- RF stability drifts with temperature; keeping return paths and components within a tight thermal window preserves measurement accuracy.
- Uneven temperatures cause false fails, device drift, and re‑tests—slowing throughput and pushing schedules.
What You’ll Receive
- A concise CFD report: temperature maps, airflow vectors, hotspot list, and °C margins vs your limits
- Board changes that move the needle: copper width/shape tweaks, via stitching for heat spread, thermal relief patterns
- Cooling guidance: heatsink/fan validation, airflow targets for the tester chamber/prober
- Derating advice for power rails and components under HTOL/HAST‑like conditions
- Optional sensor plan (where to measure for correlation).
Special Offer — 50% OFF Your First Design
PCB layout and simulation that interfaces your DUT to the tester (e.g., Teradyne J750, Ultraflex/Ultraflex Plus, Advantest 93K, T2000, NI STS), optimized for signal integrity and power delivery
Yes—pre‑layout SI/PI rules plus IBIS‑AMI, TDR, S‑parameters, eye diagrams for DDR/PCIe/USB/MIPI and SERDES to 112 Gbps
Typical 1–3 weeks depending on complexity; rush options available.
Yes—controlled impedance ±5%, RF/microwave routing, HDI microvias, and back‑drill for stub removal; co‑simulation (S‑parameters/TDR) as needed.
Stackup & constraints, Gerbers/ODB++, drill, fab/assembly notes, BOM (as needed), and simulation reports.
Yes—we tune materials, stackups, and routing rules for Teradyne/Advantest/NI resources.
We serve globally, primarily the USA, plus Canada, Europe, Singapore, Malaysia, Taiwan, Germany, and Japan.
Absolutely—we work under your NDA and keep data protected.