Validate before fab: full‑wave EM, IBIS‑AMI, TDR, S‑parameters, eye diagrams, DDR/PCIe/USB/MIPI, SERDES to 112 Gbps
PCB Simulation & Analysis
Catch issues early; reduce respins. So you cut respins and stay on schedule with data, not guesses.
Late‑stage SI/PI surprises—closed eyes, PDN resonances, via‑stub reflections, and unexpected crosstalk—burn days in bring‑up and raise respin risk. We front‑load the work with pre‑layout constraints, stackup modeling, and clear path budgets, then verify with IBIS‑AMI eye diagrams, S‑parameters & TDR, and PDN Z‑vs‑f so issues surface before you fab. For ATE hardware, we co‑simulate PCB + package + connectors/cables and align to tester channel specs, so margins are real and correlation is fast.
Interfaces We Simulate (pre‑ & post‑layout)
- LPDDR4/5
- PCIe Gen3/4/5
- USB 3.x / USB4, SATA, MIPI
- RF feed path (baluns, filters, matching)
- FPGA ⇄ ADC/DAC links
- SERDES: 56G NRZ and 112G PAM4
What We Analyze (SI/PI)
Signal Integrity (SI) | Power Integrity (PI) |
|---|---|
Return loss (S11) | IR drop & DCR |
Insertion loss (S21) | PDN impedance (Z vs f) |
Common‑mode loss | Decap optimization & placement |
Mode conversion (Scc21/Scd21) | Loop inductance |
TDR optimization | RLGC extraction |
Eye diagrams (IBIS‑AMI) | Transient droop (V vs time) |
Crosstalk (NEXT/FEXT) | Joule‑heating effects |
Tools & Expertise
- Industry‑standard solvers: Ansys HFSS/Siwave.
- End‑to‑end models: PCB + package + die, including connectors/cables.
- 3D EM for ATE test sockets, POGO pins, and probes/needles.
- Correlation support during bring‑up (measured vs simulated).
Special Offer — 50% OFF Your First Design.
PCB layout and simulation that interfaces your DUT to the tester (e.g., Teradyne J750, Ultraflex/Ultraflex Plus, Advantest 93K, T2000, NI STS), optimized for signal integrity and power delivery
Yes—pre‑layout SI/PI rules plus IBIS‑AMI, TDR, S‑parameters, eye diagrams for DDR/PCIe/USB/MIPI and SERDES to 112 Gbps
Typical 1–3 weeks depending on complexity; rush options available.
Yes—controlled impedance ±5%, RF/microwave routing, HDI microvias, and back‑drill for stub removal; co‑simulation (S‑parameters/TDR) as needed.
Stackup & constraints, Gerbers/ODB++, drill, fab/assembly notes, BOM (as needed), and simulation reports.
Yes—we tune materials, stackups, and routing rules for Teradyne/Advantest/NI resources.
We serve globally, primarily the USA, plus Canada, Europe, Singapore, Malaysia, Taiwan, Germany, and Japan.
Absolutely—we work under your NDA and keep data protected.