High‑performance ATE load board layout and high‑speed digital PCB design—DDR, PCIe, USB, MIPI, SERDES up to 112 Gbps—optimized for signal integrity, thermal stability, and durability across Teradyne, Advantest, NI & more.
High‑Speed ATE Load Board PCB Layout & Simulation
Poorly engineered load boards can trigger production delays, costly retests, and unstable yield data. In high‑volume semiconductor testing, every hour counts. CONNECT LOGIC delivers precision layout and simulation engineered to perform in high‑stress production—so you move faster with confidence.
What You Get
- Flawless signal integrity up to 112 Gbps (SERDES) with tight impedance control
- Thermal stability and power delivery engineered for repeatable results
- Mechanical durability for long‑term, high‑site reliability
- High‑speed digital expertise across DDR, PCIe, USB, MIPI, SERDES—from pre‑layout SI to final tuning to meet eye‑opening and timing budgets
With hundreds of successful designs for Ultraflex Plus, Ultraflex, Verigy 93K, NI STS, Teradyne J750, LTX Fusion, Advantest T2000, and more, we know the digital channels, analog resources, high‑current supplies, and high‑speed I/O on these testers—accelerating your design cycle and reducing risk.
Why CONNECT LOGIC?
At CONNECT LOGIC, every engineer on our team has a strong electronics background, so we truly understand the technical details behind your PCB layout needs and deliver solutions that work. With hundreds of successful ATE PCB designs under our belt, we’re intimately familiar with major tester platforms like Ultraflex Plus, Ultraflex, Verigy 93K, NI STS, Teradyne J750, LTX Fusion, Advantest T2000, and more—their resources, capabilities, and quirks are at our fingertips. Founded by a seasoned ATE PCB layout engineer, we combine deep technical expertise with a personal, hands‑on approach to tackle your toughest test hardware challenges. We also know how critical deadlines and time‑to‑market are in this business—and we consistently deliver top‑quality work, even under the most demanding schedules.
Load‑Board–Specific Capabilities
- Layers: 20–68 typical (2–86 supported)
- Fine‑pitch sockets: 0.4 / 0.315 mm
- Matched‑length routing: ±1 mil with tight skew control
- Controlled impedance: ±5% (50/90/100 Ω; mixed on same layer)
- High‑speed channels: SERDES to 112 Gbps; DDR/PCIe/USB/MIPI
- Vias: blind/buried/stack; back‑drill for stub removal
- Materials & stack‑ups tuned for Teradyne / Advantest / NI platforms
Want the full list? See our comprehensive Services Overview & Capabilities page.
Case Studies
- Teradyne J750 Load Board — ~1.3 k nets, 9‑day turnaround
- Advantest T2000 UltraLoad — ~2.7 k nets, 8‑day design cycle
So what the tester measures is your device—not artifacts from the interface board.
Special Offer — 50% OFF Your First Design
Boost yield and hit the market faster. Start with 50% OFF your first load board / high‑speed digital PCB design.
[Get Started] [Request Load Board Quote]
PCB layout and simulation that interfaces your DUT to the tester (e.g., Teradyne J750, Ultraflex/Ultraflex Plus, Advantest 93K, T2000, NI STS), optimized for signal integrity and power delivery
Yes—pre‑layout SI/PI rules plus IBIS‑AMI, TDR, S‑parameters, eye diagrams for DDR/PCIe/USB/MIPI and SERDES to 112 Gbps
Typical 1–3 weeks depending on complexity; rush options available.
Yes—controlled impedance ±5%, RF/microwave routing, HDI microvias, and back‑drill for stub removal; co‑simulation (S‑parameters/TDR) as needed.
Stackup & constraints, Gerbers/ODB++, drill, fab/assembly notes, BOM (as needed), and simulation reports.
Yes—we tune materials, stackups, and routing rules for Teradyne/Advantest/NI resources.
We serve globally, primarily the USA, plus Canada, Europe, Singapore, Malaysia, Taiwan, Germany, and Japan.
Absolutely—we work under your NDA and keep data protected.