Our Services

Load boards, probe cards, burn‑in boards, MLC, HDI & RF, simulation, Allegro training, thermal analysis—plus deep ATE platform expertise and full design capabilities.

End‑to‑end PCB layout design & simulation for semiconductor test: load boards, probe cards, burn‑in boards, MLC substrates, HDI & RF, SI/PI/EMI simulations, Allegro training, thermal analysis. We help you reduce test delays and accelerate time‑to‑market.

Thru‑hole & SMT
Layers 2–86
Blind/buried/stack vias; back‑drill; stitching vias
Fine pitch 0.4 / 0.315 mm
Matched length ±1 mil
Controlled impedance ±5%; multiple impedances per layer
Curved traces; thickness 62–250 mils
High‑speed to 112 Gbps (SERDES); DDR/PCIe/USB/MIPI
High current up to 700 A

Provide expert guidance on developing an AI strategy and integrating AI into your business processes

Develop and deploy custom machine learning models to extract insights and make predictions from your data.

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Assist in seamlessly integrating AI solutions into your existing systems and deploying them at scale.

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800 100 975 20 34
+ (123) 1800-234-5678

800 100 975 20 34
+ (123) 1800-234-5678

USA, New York – 1060
Str. First Avenue 1